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Beilstein J. Nanotechnol. 2022, 13, 298–312, doi:10.3762/bjnano.13.25
Figure 1: Energy band model of the metal–insulator contact electrification. The highest unoccupied intermedia...
Figure 2: Electrodeposition process. A PMMA plate was used as the electrodeposition liner.
Figure 3: Contact and separation of Cu and PTFE.
Figure 4: XRD diffraction patterns of the 16 samples after electrodeposition.
Figure 5: Samples 1–8 of the 16 samples were screened and classified according to the particle size. Differen...
Figure 6: Samples 9–16 of the samples were screened and classified according to the particle size. Different ...
Figure 7: The particle size distribution of samples 1–8 of the 16 copper nanostructures.
Figure 8: The particle size distribution of samples 9–16 of the 16 copper nanostructures.
Figure 9: The output performance of the 16 samples. (a) Open-circuit voltage and (b) short-circuit current.
Figure 10: (a) Effect of particle size variance on the open-circuit voltage (EG = experimental group = sample,...
Figure 11: (a1–c1) Models of pyramids, strips, and spheroids. (a2–c2) COMSOL simulation of the electric field ...